Headspring Forms Capital and Business Alliance with Silicon & System
Headspring Inc. (Head office: Shinagawa-ku, Tokyo; President & CEO: Osamu Hoshino; “Headspring”) has entered into a capital and business alliance agreement with Silicon & System CO., LIMITED (Head office: Hong Kong; Representative: Steven Chen; “S&S”). Under the alliance, Headspring will issue new shares to S&S through a third-party allotment and will begin joint development of next-generation power supplies for AI data centers with Devise Tech Inc. (“DTI”), in which S&S is a major shareholder.
The joint development will combine DTI’s power module design and development technology with Headspring’s power conversion and control technology, with the aim of commercializing power supplies for 800V-class DC power distribution.
Headspring will first begin development of a DC-DC power supply for AI data center server racks, which converts 800V-class DC to approximately 50V. The company plans to carry out customer demonstrations with this initial product and then move in stages to a next-generation model equipped with the power module jointly developed with DTI.
